One Component Epoxy

One component epoxy is a premixed adhesive system with base epoxy resin already blended with the appropriate amount of catalyst or hardener that will only react and polymerize when being exposed to the required heating temperature.

With one component epoxy, it takes away the hassle of metering and mixing as it can be dispensed directly as it is with the characteristics of two-component epoxy. Generally, one component has excellent thermal shock resistance, electrical insulation, good electrical resistance, able to withstand thermal stress and good surface hardness when fully cured. 

Due to its robust characteristics, storage temperature, and worklife, one component epoxy is being applied for Surface Mount Devices, Glob Top Encapsulant (COB), Underfill Epoxy, and many sealing and bonding purposes in the electronic field. 

Surface Mount Epoxy

Surface Mount Epoxy

Surface Mount Epoxy

Vitrobond® SMT Epoxy or Surface Mount Adhesive is mainly used for mounting and bonding surface mount devices (SMD) to the printed circuit board by way of high-speed dotting or screen printing process of the adhesive.

These SMT epoxies from the Vitrobond® range have high green strength, it can prevent the SMDs from skewing during inline movement and the solder or double-sided reflow process at 250°C temperature environment.

The SMT epoxy has  good thixotropy index that gives the dispensed dot size a controlled spherical shape from slumping before the placement of SMDs to the printed circuit board. It is fast cure at 150°C for less than 2 minutes to obtain good die shear strength. 

  • 1 component heat cure epoxy.
  • 100% solvent free.
  • Fast cure at high temperature.
  • No tailing and skewing.
  • High die shear strength.
  • Able to withstand solder reflow temperature process. 
Part No Base Colour  Viscosity, CPS Cure Time - Time/Temp 0C Glass Transition 0C Hardness,             Shore D  Specific Gravity Application
Vitrobond SMT 7611 Epoxy Resin Red 80'000 - 150'000 1800C x 90 secs 125 86 1.35 Dotting & Printing
Vitrobond SMT 7611-1 Epoxy Resin Red 52'860 1800C x 90 secs 106 87 1.35 Dotting & Printing
Vitrobond DA 650 Epoxy Resin Black 80'000 1200C x 180 secs 135 90 NA Dotting

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Glob Top Epoxy (COB)

Glob Top - COB

Glob Top Epoxy

Vitrobond® one component heat cure glob top epoxy (commonly termed as Chip-On-Board - COB epoxy) is regularly used by the printed circuit board assemblers or semiconductor players to encapsulate bare silicon chip after attachment and wire bonding process. 

The primary purpose is to protect the silicon chip or bare die from environmental exposure that may potentially short circuit it and also to prevent any form of corrosion or oxidization that may set in during the operation of the devices. 

Vitrobond® one component glob top epoxies are designed to meet the most stringent demands from the COB industry like low Thermal Coefficient of Expansion (CTE), excellent capillary action to fill in between bonding wires, low ionic contents to prevent corrosion with good thermal stress resistance.  

With a good range of viscosities and thixotropy to select from, these glob epoxies have been proven to meet the bare die encapsulation requirement and processability. 

  • 1 component heat cure epoxy.
  • 100% solvent-free.
  • Room temperature stable up to 3 - 5 days.
  • Good capillary action.
  • Low CTE.
  • Good thermal resistance.
  • Low ionic content.
Part No Base Colour  Viscosity, CPS Cure Time - Time/Temp 0C Glass Transition 0C Hardness,   Shore D  Specific Gravity Pack Size
Vitrobond VC 108 Epoxy resin Black 140'000 - 190'000 1500C x 1 Hour 140 90 1.93 10cc, 30cc & 1.5 Kg
Vitrobond VC 108-1 Epoxy resin Black 70'000 - 90'000 1500C x 1 Hour 130 90 1.45 10cc, 30cc & 1.5 Kg
Vitrobond JD 322 Epoxy resin Black 128'000 - 195'000 1500C x 20 Mins 132 90 1.33 10cc, 30cc & 1 Kg
Vitrobond EN 640-T5 Epoxy resin Black 140'000 - 190'000 1400C x 1 Hour 130 89 1.86 10cc, 30cc & 1 Kg
Vitrobond EC 115 Epoxy resin Black 70'000 - 90'000 1300C x 20 Mins 125 125 1.40 10cc, 30cc & 1 Kg

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Underfill Epoxy

Underfill Epoxy

Underfill Epoxy

Vitrobond® Underfill Epoxy 

  • 1 component heat cure epoxy.
  • 100% solvent free.
  • Fast cure at high temperature.
  • No tailing and skewing.
  • High die shear strength.
  • Able to withstand solder reflow temperature process. 
Part No Base Colour  Viscosity, CPS Cure Time - Time/Temp 0C Glass Transition 0C Hardness,             Shore D  Specific Gravity Application
Vitrobond SMT 7611 Epoxy Resin Red 80'000 - 150'000 1800C x 90 secs 125 86 1.35 Dotting & Printing
Vitrobond SMT 7611-1 Epoxy Resin Red 52'860 1800C x 90 secs 106 87 1.35 Dotting & Printing
Vitrobond DA 650 Epoxy Resin Black 80'000 1200C x 180 secs 135 90 NA Dotting

>Request for Technical Data Sheet

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