CONDUCTIVE ADHESIVES

Conductive Adhesives

Conductive adhesive or epoxy is a critical component for any attachment of semiconductor chips to lead frame or fiberglass reinforced phenolic (FR4) substrates for electrical or thermal conductivity of the IC package. With die attach adhesive, it has clear advantage over solder as it has better flexibility and will have less stress induced due to substrates CTE mismatch. 

Die Attach adhesives are formulated to be either electrically or thermally conductive only depending on the application requirement. For electrically conductive Die Attach paste or film is composed mainly of silver or precious metal like Gold and Boron Nitride or Carbon-based compounds are used for thermal conductivity purpose. 

By partnering with some of the most prominent adhesives company like A I Technology, Everwide Chemical Co, Timtronics and locally established Vitrobond to provide the Semiconductor & IC Packaing industries with an extensive range of specialty conductive and non-conductive adhesives for the electronics package and assembly application.

 

Conductive Paste, Film & Wafer Dicing Tape

Die Attach Epoxy Paste

  • Dielectric, Electrically Conductive and/or Thermally Conductive

  • Snap-Curing series with 100% solid for ultimate productivity

  • Wire-bonding capable to 250°C for faster throughput applications

  • Usage temperatures from standard Mil-Std and automotive electronics to >250°C specialty applications

  • Large area low-stress series

  • Choices of viscosities for screening-stenciling or pin-transfer

  • Choices of electrical and/or thermal performance based on silver, gold, diamond, alumina, aluminum and boron nitride, and other specialty metals and derivatives

  • Tg=240°C and -55°C and combinations for specialty applications

  • Prima Bond EG8020 - 2 Component silver-filled epoxy.
  • Prima Bond EG8050-LV - 2 Component flexible silver-filled epoxy.
  • Prima Solder EG8050 - 1 component silver-filled epoxy with high flexibility.
  • Prima Solder ME8155 - 1 component silver-filled epoxy with stress-free property
  • Prima Solder ME8456 - Reworkable, pure silver-filled epoxy.
  • Prima Solder ME8456-00 - Ideal for mismatched CTE.
  • Prima Solder ME851 - Solvent free. Designed to eliminate bleeding.
  • Prima Solder ME8550-DA - High green strength. Moisture resistance.
  • Prima Solder ME8630-DA - Solvent free. Fine pitch. Rapid curing for inline process. 
  • Prima Solder ME8630-RC - Solvent free. Fine pitch. Rapid curing for inline process
  • Prima Solder ME8650-DA - Solvent-free.  Fine pitch. Rapid curing
  • Prima Solder ME8650-RC - Solvent-free.  Fine pitch. Rapid curing
  • Prima Solder ME8850-DA - Stress-free. High green strength.
  • Prima Solder MC8880 -  Solvent free. Withstands 350 Deg C. Low Moisture Absorption. Low Ionics


  • Vitrobond AG 806-2 - Silver filled epoxy, 1 Part heat cure.

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  • Prima Bond EG7655- Stress-free. One or two-component. Large bonding areas.
  • Prima Bond EG7658 - Substrate attach. Large bonding areas. Bonding mismatched CTE’s.
  • Prima Bond ME7155 - Solvent free. Stress-free.
  • Prima Bond ME 7155AN - Solvent free. Stress-free.
  • Prima Bond ME7156 - Stress-free. Mismatched CTE’s
  • Prima Bond ME7158 - Stress- free. High power die attach.
  • Prima Bond ME7159 - Stress-free. Diamond filled.
  • Cool Bond ME7635-RC - Solvent-free. Rapid inline curing. More than 7 days pot-life.
  • Cool Bond ME7655-RC - Solvent-free. Rapid inline curing. More than 7 days pot-life.
  • Cool Bond ME7656 - Stress-free. Fast curing.
  • Cool Bond ME7665DA - Solvent-free. Low-temperature curing.
  • Cool Bond ME7857-SC - Solvent-free. High green strength.
  • Cool Bond ME7863 - Solvent-free.  Withstands 350 Deg C. Low Moisture Absorption. Low Ionics

  • Vitrobond DA 650 - 1 part heat cure epoxy. Non-conductive. Fast cure

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Die Attach Film (DAF)

Die-Attach film (DAF) adhesive has become popular and mandatory when stack chips are used to accomplish larger capacity in 3-D packaging of flash memory devices.  The push now is for even thinner insulating die-attach adhesive that can properly handle interfacial stresses in stacking chips with bond-lines as thin as 8-10 microns or less to help mobile devices to achieve even lower profiles.

  • Die-Attach Film (DAF) for precision and high-density die-attaching
  • Dielectric, Electrically Conductive and/or Thermally Conductive
  • Controlled to Snap-Curing with high melt-flow for ultimate performance
  • Wire-bonding capable to 250°C for faster throughput applications
  • Usage temperatures from standard Mil-Std and automotive electronics to >250°C usage specialty applications
  • Choices of electrical and/or thermal performance based on silver, gold, diamond, alumina, aluminum and boron nitride, and other specialty metals and derivatives
  • Tg=240°C and -55°C and combinations for specialty applications
  • ESP7660-HK-DAF -Post-curing without fixture and pressure. Meets MIL-STD-883F 5011.4. Proven reliability for multilayer stack
  • ESP7666-HK-DAF - Curing without fixture and pressure. Meets MIL-STD-883F 5011.4. Low thermal resistance + high moisture resistance
  • ESP8660-HK-DAF - Curing without fixture and pressure. Low thermal resistance + high moisture resistance. Meets MIL-STD-883F 5011.4
  • ESP8450-DAF -Optimizing flexibility and strength. Proven for extreme large devices. Meets MIL-STD-883F 5011.4. Low thermal resistance + high moisture resistance

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FLOW-OVER-WIRE (FOW) DIE-ATTACH FILM:

FOW DAF adhesive has an additional processing capability to flow over the wire of the wire-bonded section of the stacked chip. The same process of pre-lamination onto the wafer before dicing is achieved with a lower pressure at  slightly lower temperature for AIT FOW DAF. The adhesive film behaves more like a liquid adhesive once it reaches the designed temperature of 90-150°C. AIT FOW DAF is engineered with high Tg and molecular stress absorption capability.

  • ESP7660-FOW 
    • Wafer level pre-lamination @70-80°C
    • Wafer level packaging for up to 450mm
    • Melt-flow for bonding @90-150°C
    • Outstanding stress absorption and moisture barrier
  • ESP7666
    • Wafer level pre-lamination @70-90°C
    • Wafer level packaging for up to 450mm
    • Melt-flow for bonding @100-150°C
    • Outstanding moisture barrier

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Dicing Die Attach Film (DDAF)

AI Technology, Inc. is the only US company that is well known to manufacture its own dicing tapes for wafer dicing in the United States since 2005. While AIT manufactures more traditional controlled peel, UV and heat induced releasing dicing and grinding tapes, one of its pioneering technologies in the controlled peel strength dicing tape application is the availability of tapes that withstand high temperature exposure up to 250°C.

The compatibility of the dicing tapes with the DAF adhesive must be tested and proven before adoption. In this application of dicing tape with die-attach adhesive there are two basic criteria beyond the traditional characteristics:

  1. It must have good bonding to the DAF and yet can be released without causing part of the DAF to be delaminated from the diced chips.
  2. The DAF must be free of residuals after the dicing tape is removed.

In addition to not leaving residuals on the DAF on the diced chip, AIT dicing tapes designed for the DDAF application are engineered to blend and form part of the DAF during curing to eliminate all fear of contamination induced failure.

  • Die-Attach Film (DAF) on UV releasing or peel-release dicing tapes (DDAF)
  • Dielectric, Electrically Conductive and/or Thermally Conductive
  • Controlled to Snap-Curing with high melt-flow for ultimate performance
  • Wire-bonding capable to 250°C for faster throughput applications
  • Usage temperatures from standard Mil-Std and automotive electronics to >250°C usage specialty application
  • Choices of electrical and/or thermal performance based on silver, gold, diamond, alumina, aluminum and boron nitride, and other specialty metals and derivatives
  • Tg=240°C and -55°C and combinations for specialty applications
  • DT-UV1200-SE4 - UV and/or heat releasing
  • DT-UV3200-C1 -   UV and/or heat releasing
  • DT-CR1000-SE3 -  Controlled and stable peel strength over time
  • DT-CR1200-R5
    • Controlled and stable peel strength over time
    • Withstand minutes of exposure up to 250°C
    • Available in anti-static version

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