THERMAL MANAGEMENT COMPOUNDS

Thermal Management Compounds

With enhanced and innovative thermal management compounds like greases (silicone and non-silicone), paste, pad, gap fillers, and heat-dissipating adhesives have enabled the electronic and semiconductor industries to design and produce microchips, mobile devices, telecommunication equipment, and wearable devices with faster connectivity and performance due to better heat management from the range of thermal management products. 

Using its proprietary engineering technology, Timtronics is the leading global manufacturer of Non-Silicone based of thermal interface management and with a range of high performance, reliable thermal silicone greases, paste, liquid gap fillers, pads, and thermal potting encapsulants. 

 With more than 50 years of experience in the research, development, and production of thermal management compounds and applicable for major electronics and O.E.M corporations using proprietary technology and engineering expertise, Timtronics' products have been designed into thousands of applications and help guarantee the performance, integrity, survivability, and maintainability of communications equipment, automotive, radars, aircraft, missiles, spacecraft, computers, fire control systems, and industrial electronics.

Timtronics Brochure Front

Thermal Greases

Thermal Greases & Paste

When it comes to heat management systems of heat sinks, thermistors, CPU & IGBT, the offering of Timtronics' thermal grease technology provides high thermal conductivities, minimum bond-line thicknesses, and surface wetting. With high-performance thermal greases, it keeps the operating devices and system cool and uninterrupted from overheating or disruption in thermal upswing during operation. 

An extensive range of grease is available in Silicone & Non-Silicone formulations to cater to different industries' specifications. Thermal greases are further designed for easy application, screen printable and to offer low cost, low thermal interface resistance for superior thermal transfer. Available in the following categories:

Timtronics Thermal Grease

Thermal Grease

  • High thermal conductivity ranging from 0.5 ∼ 6 W/m°K
  • Low impedance
  • Available in Silicone & Non-Silicone paste
  • FDA grade available

Blue Ice™ Series

Non-Silicone Thermal Compounds

Blue Ice Series are unique synthetic thermal greases engineered to provide low bleed and oil migration (Pump Out) to prevent component contamination associated with silicone greases. They offer superior thermal conductivity and low thermal resistance with long-term stability.

Why Non-Silicone preferred over Silicone thermal greases?

SILICONE NON-SILICONE

Low Surface Tension causes oil separation, bleed. and pump out which leads to contamination and premature failure

Synthetic fluids. high surface tension keeps oil and fillers together
Several thermal cycles cause dry out, and interface film cracking resulting in a loss of thermal conduction Formulated with special binding agents, no oil separation. stays put, dissipates the heat efficiently
Increased temperatures volatilize silicone fluids and forms silicone dioxide—an electrical insulator causing defective contacts in motors, relays, and switches Synthetic fluids volatilize clean
Silicone fluids will contaminate the solder bath in the reflow process No contaminations: compatible with solder bath chemicals

Typical Applications:

CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, LED. TEC modules, Telecommunication hardware, etc.

Availability:

Syringes (3cc, 10cc, 30cc). Jars (8oz& 1 Kg). Cartridges (6 oz. Semco & 300cc). 1 gallon & 5 gallon pail

Property Test Method 411 412 4100 4100LV 430 4200 4050LV 4060
Type   Silicone Free Silicone Free Silicone Free Silicone Free Silicone Free Silicone Free Silicone Free Silicone Free
Special Features   Low Vis,
Thin BLT
High
Die- electric
No Sag, Stable Screen printable, thin BLT High
Die- electric
Tacky, Zero Pump out Tacky, Zero Pump out High TC, Stable
Color Visual White White Gray Gray White Gray Gray Gray
Viscosity
5 rpm @
25°C, PaS
Helipath 90 400 400 100 220 450 480 700
Specific Gravity ASTM D792 2.4 2.7 2.2 2.2 2.7 2.4 2.4 2.4
Operating Temperature Range.°C   -55°C  to 200°C -55°C  to 200°C -55°C  to 200°C -55°C
to 200°C
-55°C  to 200°C -55°C  to 200°C -55°C
to
200°C
-55°C  to 200°C
Shelf Life   5 years 5 years 5 years 5 years 5 years 5 years 5 years 5 years
THERMAL                  
Thermal Conductivity
(W/m-K)
ASTM D5470 0.8 2.0 2.6 2.6 3.0 3.2 5.0 6.0
Thermal Resistance
°C-in²/W
ASTM D5470 0.03 0.03 0.014 0.014 0.01 0.01 0.005 0.005
ELECTRICAL                  
Breakdown Voltage(KV/mm) ASTM D149 12.4 16 2.8 2.8 16 2.8 2.8 2.8
Dissipation Factor(1KHz) ASTM D150 0.0021 0.003 0.12 0.12 0.017 0.12 0.12 0.12
Volume Resistivity   (Ohm-cm) ASTM D257 10^14 10^14 10^9 10^9 10^14 10^9 10^9 10^9

White Ice Series

Silicone Thermal Compounds

White Ice series are silicone-based thermal greases engineered with special binding agents to reduce bleed and oil separation. These compounds offer excellent wetting properties, spreadability, and the low viscosity formulation makes them easy to apply to thin bond line thickness for minimum thermal resistance. Timtronics silicone compounds offer superior conductivity, low thermal resistance, and long-term stability.

Typical Applications:

CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, LED. TEC modules, Telecommunication hardware etc.

Availability:

Syringes (3cc, 10cc, 30cc). Jars (8 oz.& 1 Kg). Cartridges (6 oz. Semco & 300cc).1 gallon & 5 gallon pails

Property Test Method 510 510CR 511 515 5100

530

Type   Silicone Silicone Silicone Silicone Silicone Silicone
Special Features   Screen Printable Thixotropic.
Non-Sag
High Dielectric High
Dielectric
Non-Sag Stable High TC,
Color Visual White White White White Gray Light Gray
Viscosity
5 rpm @ 25°C, PaS
Helipath 150 720 50 40 550 180
Specific Gravity ASTM D792 2.2 2.3 2.5 2.0 2.2 2.7
Operating Temperature Range.°C   -55°C  to 205°C -55°C  to 205°C -55°C  to 205°C -55°C  to 205°C -55°C  to 205°C -55°C  to 205°C
Shelf Life 5 years 5 years 5 years 5 years 5 years 5 years 5 years
THERMAL              
Thermal Conductivity
(W/m-K)
ASTM D5470 0.8 1.0 2.0 2.0 2.6 3.0
Thermal Resistance
°C-in²/W
ASTM D5470 0.05 0.05 0.025 0.017 0.01 0.01
ELECTRICAL              
Breakdown Voltage(KV/mm) ASTM D149 15 15 16 16 2.8 16
Dissipation Factor
(1KHz)
ASTM D150 0.0021 0.0021 0.0028 0.0026 0.1277 0.0028
Volume Resistivity
(Ohm-m)
ASTM D257  10^14 10^14 10^14 10^14 10^9 10^14

Red Ice Series

High-Temperature Thermal Compounds
Product Description:

Red Ice series are high temperature stable thermal greases engineered with special aerospace fluid technology to eliminate compound "dry out" problems due to continuous operating temperature above 200 °C. This series of thermal compounds has shown outstanding heat transfer and high-temperature stability for all types of electronic and industrial applications. Recommended for aerospace application because of low to zero outgassing, No dry out when application stays under recommended temperature range.

Typical Applications:

Aero Space applications, Heater cartridges, 3D printers Thermistors, RTD, Thermocouple wells, Portable heaters and tank heaters.

Availability:

Syringes (3cc, 10cc, 30cc). Jars (8 oz.& 1 Kg). Cartridges (6 oz. Semco & 300cc).1 gallon & 5 gallon pails

Most Popular Products:

Red Ice 611HTC: High thermal conductivity with high-temperature stability. Rated up to 360°C. Meets NASA outgassing requirements.

Red Ice 611: Thermally Conductive with high-temperature stability. Rated up to 360 °C. Meets NASA outgassing requirements. Commonly used between the heating element (Cartridge Heater) and plate. Apply to Cartridge Heater to remove air gap

Red Ice 613: Low-cost solution for the high-temperature application, Rated up to 250 °C. Commonly used with a temperature sensor to improve response time.

Property Test Method 615 613 614 610 611 611LV 611HTC
Type   Silicone Silicone Silicone Silicone Free Silicone Free Silicone Free Silicone Free
Special Features   250°C
Low cost
250°C
High TC
250°C
High TC
300°C
No-Sag
360°C
No-Sag
Low viscosity.
360°C
No-Sag
360°C
High TC
Color Visual White White Gray White White White Gray
Viscosity
50 rpm @ 25°C, PaS
Helipath 50 60 100 600 200 100 150
Specific Gravity ASTM D792 2.4 2.3 2.1 2.9 3.0 3.0 3.2
Shelf Life   5 years 5 years 5 years 5 years 5 years 5 years 5 years
Operating Temperature Range.°C   -55°C to 250°C -55°C  to 250°C -55°C  to 250°C -55°C  to 300°C -55°C  to 360°C -55°C  to 360°C -55°C  to 360°C
THERMAL                
Thermal Conductivity
(W/m-K)
ASTM D5470 0.9 1.2 2.2 1.0 0.8 0.8 3.2
Thermal Resistance
°C-in²/W
ASTM D5470 0.045 0.04 0.03 0.05 0.06 0.06 0.0016
ELECTRICAL                
Breakdown Voltage   (KV/mm) ASTM D149 17 16 2.8 14 15 15 3
Dissipation Factor     (1KHz) ASTM D150 0.0025 0.0025 0.12 0.0020 0.0016 0.0016 0.12
Volume Resistivity   (Ohm-m) ASTM D257 10^15 10^14 10^9 10^14 10^14 10^14 10^10
Outgassing
%TML
%CVCM
ASTM E595 Not Tested Not Tested Not Tested Not Tested

0.90
0.01

Not Tested

0.90
0.01

White Ice FG series

Food Grade Heat Sink Compound
(NSF Registered)
Product Description:

White Ice FG series is a Non-Reactive, Silicone, Thermally Conductive food grade thermal grease with low thermal resistance and soft, non-flowable consistency. This product is formulated with FDA (Food & Drug Administration) approved ingredients in compliance with CFR, Title 21 paragraph 178.3570 of the FDA guidelines and NSF Registered. This product is acceptable as incidental food contact for use in and around food processing areas.

Key Features and Benefits:
  • Good Thermal Performance- ( 1.0 W/m °k)
  • Low Interface Thermal Resistance. – ( 0.05 °C-In2 /W)
  • Service Temperature up to 300C
  • Low bleed and evaporation
  • Non-Toxic/ NSF Registered
  • Re-workable/Easy to Remove
  • Easy to Apply by Dispensing or Screen Printing/Stencil
Typical Applications:

White Ice food grade Heat Sink Compound is applied to any electronic device for heat transfer which is located in and around food processing areas. Also, industrial applications include mounting studs of transistors, diodes, and silicone controlled rectifiers. In these situations, a small amount of thermal grease is applied using screen printing/stencil methods. It is also used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; coupling entire heat generating assemblies to chassis; heat transfer medium on ballasts; thermal joints; thermocouple wells; mounting power resistors; and for any devices where efficient cooling is required in major industries including, electronic (computer, appliance, wireless, etc.), automotive and electrical.

Availability:

Syringes (3cc, 10cc, 30cc). Jars (8 oz. & 1 Kg). Cartridges (6 oz.& 300cc). 1 gallon & 5-gallon pails

Property Test Method  510FG 610
Type   Silicone Silicone Free
NSF Registration Number.
Company Number: N06854
  139292 149699
Special Future   Low viscosity.
General purpose

High Temperature. Rated up to 300C

Color Visual White White
Viscosity
@ 25°C, PaS
Helipath 160 600
Specific Gravity ASTM D792 2.2 2.9
Shelf Life   5 years 5 years
Operating Temperature Range.°C   -55°C to 200°C -55°C to 300°C
THERMAL      
Thermal Conductivity
(W/m-K)
ASTM D5470 0.8 1.0
Thermal Resistance
( °C-in²/W)
ASTM D5470 0.05 0.05
ELECTRICAL      
Breakdown Voltage (KV/mm) ASTM D149 15 14
Dissipation Factor (1KHz) ASTM D150 0.0021 0.0020
Volume Resistivity (Ohm-cm) ASTM D257 10^14 10^14

Black Ice and Silver Ice (700 series)

Electrically and Thermally Conductive Compounds
Product Description:

700 series are electrically and thermally conductive greases engineered with highly conductive fillers and silicone/non-silicone fluids. Excellent wetting and spreadability with screen printable consistency. The 700 series is ideal for low-power applications that require a static drain, grounding, and soft electronics connection. High thermal conductivity ratings up to 7.2 W/mºK are readily available.

These products fill microscopic pits/gaps, providing multiple pathways for current to follow so no current lost. This creates almost zero resistance in the connection, protecting against vibration, no overheating, and no voltage fluctuations.

Typical Applications:

High power electrical applications, Power switches, Circuit breakers, Grounding semiconductor components and high power CPU to heat sink, Overclocking CPU. Communication equipment-cell phone connections;antennas; HAM radios. Lighting-LED, motion sensors.

Popular Products:

Silver Ice 720: Non-Silicone type. Offers wet/oily type film. Pure silver fortified thermal greases, non-curable system. Thermal conductivity of 7.2 W/mºK. Direct replacement of “Arctic Silver” products. Recommend for high heat flux & thin film applications.

Silver Ice 710NS: Offers wet/oily film, easy to spread and achieve thin BLT, full interface contact with low pressure. Pure silver fortified thermal greases, non-curable system. Thermal conductivity of 7 W/mºK.

Black Ice 713: Heavy gel/putty type consistency, offers high temperature stability up to 360C. Designed to fill large gaps where electrical conductivity required with minimum stress to the component

Property Test Method  710 710NS 720 711 712 713
Type   Silicone Free /Silver Silicone Free/Silver Silicone Free/Silver Silicone Free Silicone Silicone Free
Special Features   Dry Film
Highly Electrically conductive
Wet/oily film. Highly Electrically Conductive Wet/oily film. Highly Electrically Conductive Low cost.
Moderate Elec. Conductive
Low cost.
Moderate Elec. Conductive
Stable up to 360°C
Putty type.
Moderate Electrically Conductive
Color Visual Silver Silver Silver Black Black Black
Viscosity
@ 25°C, PaS
Helipath 500 200 250 250 250 >5000
Specific Gravity ASTM D792 4.8 4.0 4.2 1.3 1.3 3.2
Operating Temperature Range.°C   -55°C to 200°C -55°C to 200°C -55°C to 200°C -55°C to 200°C -55°C to 200°C -55°C to 360°C
THERMAL              
Thermal Conductivity
(W/m-K)
ASTM D5470 7.0 (Laser Flash) 7.0 (Laser Flash) 7.2 (Laser Flash) 2.2 2.2 1.8
Thermal Resistance
( °C-in²/W)
ASTM D5470 0.01 0.01 0.008 0.05 0.05 N/A
ELECTRICAL              
Breakdown Voltage (KV/mm) ASTM D149 N/A N/A N/A N/A N/A N/A
Dissipation Factor (1KHz) ASTM D150 N/A N/A N/A N/A N/A N/A
Volume Resistivity (Ohm-cm) ASTM D257 <0.010 <0.010 <0.010 <0.25 <0.25 <0.25

EJC Series

Electrical Joint Compounds (EJC) are specially formulated with the latest technology to prevent oxide film formation on metal surfaces and prevents corrosion. It offers superior weathering characteristics over wide temperature ranges and provides highly conductive tight joints. Proprietary filler particles help in penetrating oxide films and act as electrical bridges between conductor strands, aid in gripping conductor, Mounting Hockey Puck to improve electrical conductivity and enhance the integrity of the connection.

Key Features:
  • Prevent oxide films
  • Improved service life for both copper and aluminum connections.
  • Provide “gas-tight “with high conductivity.
  • Excellent lubricant reduces galling & seizing
Easy to apply:
  • Scratch the conductor surfaces with a brush until bright and clean.
  • Immediately apply EJC compound to the conductive surfaces.
  • Remove all excess compounds after installation is complete.
Availability:

Syringes (3cc, 10cc, 30cc). Jars (8 oz & 1 Kg). Cartridges (6 oz. & 300cc). 1 gallon & 5 gallon pails

PRODUCT EJC-741 EJC-742 EJC-744 EJC-745SL EJC-745NS
APPLICATION/
RECOMMENDATION
Insulated Al/Al & Al/Cu connections, Aluminum conduit threads Copper to copper connections, copper conduit thread, and grounding Transmission line compression dead-end, splice, aluminum terminal joints, or ACSR conductor Insulated Al/Al & Al/Cu connections, Excellent heat transfer paste. Insulated Al/Al & Al/Cu connections. Excellent heat transfer paste.
Product Type Non-Silicone Non-Silicone Non Silicone/Abrasive Silicone Non-Silicone
Color Black Copper Amber White/Gray White/Gray
Penetration
@77°F
250-300 250-300 250-300 300-320 300-320
Service Temperature Range. -40°C to 150°C -40°C to 150°C -40°C to 150°C -40°C to 200°C -40°C to 200°C
Thermal Conductivity. W/mK 1.0 0.90 0.50 0.80 1.0
Water resistance Excellent Excellent Good Good Good
Chemical resistance Excellent Excellent Good Good Good
Oxidation Protection Excellent Excellent Good Good Good

Dielectric Valve Grease

Description/Applications:

Electrical connections are susceptible to the chemicals and moisture in their environments. If a connection develops corrosion it can affect the way the entire electrical system functions. Dielectric grease keeps moisture out of electrical connections. Use dielectric grease on spark plug wires and trailer hitch connections to prevent fusing, Dielectric grease can be used on battery terminals to keep them corrosion-free. Prevent voltage leakage by using dielectric grease to seal high energy ignition systems. With a high-temperature tolerance, dielectric grease is suitable for high heat under hood applications, such as automotive wiring connectors.

Availability:

30cc Syringe, 1 Kg jar, 40 lbs pail and 55 gallon drum.

Property Test Method  910
Type   Silicone
Special Features   Food Grade
High Dielectric property
Moisture repellent
Color Visual Translucent
Viscosity
@ 25°C, PaS
Helipath 70
Penetration (Worked) ASTN D217 310-330
Specific Gravity ASTM D792 1.1
Operating Temperature Range.°C   -55°C to 200°C
THERMAL    
Thermal Conductivity
(W/m-K)
ASTM D5470 0.09
Thermal Resistance
( °C-in²/W)
ASTM D5470 N/A
ELECTRICAL    
Arc Resistance, Seconds ASTM D495 120
Breakdown Voltage (KV/mm) ASTM D149 20
Dissipation Factor (1KHz) ASTM D150 N/A
Volume Resistivity (Ohm-cm) ASTM D257 10^13

Thermal Gels / Putties

Thermal Putties

Non-Silicone, One Part -  No-Cure Type.
Thermally Conductive, Form-In-Place Dispensable Gap Fillers

TIM-PUTTY is ‘Ultra Soft” and highly conformable one part, paste type, Non-Curetype gap filler. Its “ultra-soft” consistency assures efficient heat transfer between delicate parts where minimum pressure can be tolerated. This Form-in-place gap filler is ideal for applying any thickness with little or no stress. It is designed to provide a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. TIM-PUTTY easily forms and adheres to most surfaces, shapes, and sizes of components with very low compression force. Non-Silicone formulas avoid silicone contaminations to delicate devices. It can be easily dispensed from cartridges or pails using the pneumatic dispenser.

Gap Fillers are used to filling air gaps between components or PC boards and heat sinks, metal enclosures, and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. Gap Filler materials allow the designer to be less concerned with components' proximity to heat sinks or heat spreaders.

  • Superior thermal performance
  • Solves the toughest heat transfer problems
  • Low deflection force required
  • Minimal stress on components
  • 30cc Syringes
  • 1 Kg Jar
  • 6 oz. Semco & 300cc cartridges
  • 1 gallon & 5-gallon pails
Property Test Method 616 418 418HTC 3W 45 5W 6W
Type     Non-Silicone Non-
Silicone
Non-Silicone Non-Silicone Non-
Silicone
Non
-Silicone
Special Features   High Temp rated (360°C)
Zero Out Gassing.
Low viscosity.
High Dielectric.
Medium viscosity.
High Dielectric
Tacky Texture.
Zero Pump out
High Dielectric.
Low viscosity.
Tacky Texture.
Zero Pump out
High viscosity
High Thermal conductivity
High viscosity
High Thermal conductivity
Color Visual Gray White Gray White Gray Gray Gray
Viscosity
5 rpm @ 25°C, PaS
Brookfield 2400 4500 4900 7000 4400 7000 7000
Specific Gravity, @ 25°C ASTM D792 3.0 2.7 2.1 2.5 2.3 2.3 2.3
Hardness
(Shore 00)
ASTM D2240 <5 <5 <5 <5 <5 <5 <5
Flammability
(Equivalent)
UL 94 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Operating Temperature Range.   -40°C to 360°C -40°C to 150°C -40°C to 150°C -40°C to 150°C -40°C to 150°C -40°C to 150°C -40°C to 150°C
Shelf Life   5 years 5 years 5 years 5 years 5 years 5 years 5 years
THERMAL                
Thermal Conductivity (W/m-K) ASTM D5470 2.0 2.0 2.5 3.5 4.5 5.0 6.0
ELECTRICAL                
Breakdown Voltage (KV/mm) ASTM D149 3.0 16 3 14 3 3 3.2
Volume Resistivity (Ohm-m) ASTM D257 10^9 10¹² 10^9 10¹² 10^9 10^9 10^9
UL Lgog

TIM-LGF Series

Silicone, Cure Type Dispensable Liquid Gap Fillers

TIM-LGF are thermally conductive liquid gap filler materials formulated to provide a balance of cured material properties, highlighted by “gel-like” modules and a good compression set or memory. This material is available in thermally conductive & electrically insulating, one part or two-part, room or elevated temperature curing systems. Form-in-place gap fillers are ideal for applying any thickness with little or no stress.

Liquid Gap Fillers

Liquid Gap Fillers

  • Ultra soft and highly conformable paste ant putty.
  • Provides zero stress to sensitive components.
  • Excellent thermal conductivity.
  • Low thermal impedance.
  • Available in variable thickness.
  • High temperature resistance.

Ideal for circuit boards where multiple packages of variable heights require a thermal path to heat sink or enclose. Automotive Electronics Control Units (ECU’s), power supplies & semiconductors, memory and power modules and fiber optics telecommunications equipment.

  • Dispensable, easy mix ratio
  • Highly conformable at low pressures
  • Ambient or accelerated cure schedules
  • Thixotropic nature makes it easy to dispense
  • Prevents pump-out from the interface
  • Reworkable
  • 50cc & 400cc dual Syringes/Cartridges
  • 1/10 gallon caulking cartridge
  • 10 gallon kits
Property Test Method 2004 2005 2006 2007 2030 2301
Type   Two Parts Silicone Two Parts Silicone Two Parts Silicone Two Parts Silicone Two Parts Silicone One Part
Silicone
Special Futures   High Viscosity
No Slump
Very soft/Gel type cure Controlled cure,No Slump
Grease/Paste type cure
Soft cure
High TC
Soft cure
High TC
Thixotropic
Fast Cure
RTV Sealant
Color Visual Pink Grey Blue Blue Green White
Mixed Viscosity. PaS Brookfield 150 73 120 80 400 N/A
Mix Ratio   1:1 1:1 1:1 1:1 1:1 N/A
Specific Gravity ASTM D792 2.8 2.0 2.1 2.5 2.5 1.29
Hardness(Shore 00) ASTM D2240 70 <5 Thixotropic Paste 45 35 35
Pot Life @ 25°C   60 min 90 min 24 hrs 90 min 60 min 15 min
Cure Time @ 25°C   24-48 hrs 24-48 hrs 48 hrs 24-48 hrs 24-48 hrs 24 hrs
Cure Time @ 100°C   20 min 30 min 5 min 30 min 30 min N/A
Flammability
(Equivalent)
UL 94 V-0 V-0 V-0 V-0 V-0 V-0
Operating Temperature Range.   -55°C to 204°C -55°C to 204°C -55°C to 204°C -55°C to 204°C -55°C to 204°C -55°C to 260°C
Shelf Life(Unopened)   12 months 12 months 12 months 12 months 12 months 12 months
THERMAL              
Thermal Conductivity  (W/m-K) ASTM D5470 2.0 1.2 0.8 1.5 3.5 0.20
ELECTRICAL              
Breakdown Voltage   (KV/mm) ASTM D149 12 12 12 12 13 12
Volume Resistivity   (Ohm-m) ASTM D257 10¹² 10¹² 10¹² 10¹² 10¹² 10¹²

Thermal Gap Fillers & Pads

Thermally Conductive Silicone Gap Fillers

TIM-GAP Series

TIM-GAP series is designed to meet the industry’s growing need for interface material with high conductivity and greater conformability for easier application. Electrically isolating property allows its use in applications requiring isolations between heat sinks and high voltage, bare leaded devices. Available in Silicone and Non-Silicone formulas, thermal conductivity up to 16 W/mºK

 

Gap Fillers are used to filling air gaps between components or PC boards and heat sinks, metal enclosures, and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. Gap Filler materials allow the designer to be less concerned with components proximity to heat sinks or heat spreaders.

TIM-GAP HTC-16: High thermal conductivity (16 W/mºK) with low modulus. Excellent choice for high speed processor with very high heat flux in a small area.

TIM-GAP 1161: Conformable, thermally conductive with electrically insulated. Commonly used in uneven, irregular surfaces to fill air gaps. High thermal conductivity (6.1 W/mºK) with low modulus.

TIM-GAP 1128: Cost-effective, maximize heat transfer from electronic components to the heat sink or heat spreaders. High thermal conductivity (2.8 W/mºK) with low modulus.

TIM-GAP 1113: Low Cost solution. Specially designed for extremely low stress applications, clean, production friendly, lowest modulus type, viscoelastic thermal interface material.

Sheet form (200mm x 300mm) and Custom die-cut parts

Property Test Method 1113 1115 1128 1161 HTC-13 HTC-16 NS
Type   Silicone Silicone Silicone Silicone Silicone Silicone Non-Silicone
Color Visual Pink Gray Gray Gray Gray Gray Gray
Specific Gravity, @ 25°C ASTM D792 2.0 2.1 2.5 3.22 3.3 3.2 2.1
Hardness
(Shore 00)
ASTM D2240 24 25 50 45 75 72 53
Flammability
(Equivalent)
UL 94 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Operating Temperature Range.   -40°C to150°C -40°C to150°C -40°C to150°C -40°C to 150°C -40°C to 150°C -40°C to 150°C -40°C to150°C
THERMAL                
Thermal Conductivity (W/m-K) ASTM D5470 1.3 1.7 2.8 6.1 13.2 16.0 1.6
Thermal Resistance with Pressure
(°C-in2/w)
(1 mm Th)
ASTM D5470 15psi 0.93
40psi 0.71
70psi 0.60
15psi 0.97
40psi 0.80
70psi 0.70
15psi 0.55
40psi 0.44
70psi 0.40
14psi 0.37
50psi 0.31
70psi 0.28
14psi 0.16
50psi 0.15
70psi 0.14
14psi 0.13
50psi 0.12
70psi 0.11
14psi 1.02
50psi 0.78
70psi 0.61
ELECTRICAL                
Breakdown Voltage (KV/mm) ASTM D149 16 13 14 14 12 10 11
Dielectric Constant (1KHz) ASTM D150 N/A 4.2 6.0 8.1 8.6 4.5 7.2
Dissipation Factor (1KHz) ASTM D150 N/A 0.04 0.03 0.02 0.04 0.05 0.04
Volume Resistivity (Ohm-m) ASTM D257 1.2 x 10¹² 1.1 x 10¹² 1.2 x 10¹² 1.5 x 10¹¹ 1.0 x 10¹¹ 1.0 x 10¹¹ 1.0 x 10¹²
Available Thickness.mm   0.5 to 5.0 0.5 to 5.0 0.5 to 5.0 0.5 to 5.0 0.5 to 3.0 0.3 to 3.0 0.5 to 3.0
Available Sheet size   300mm x 200mm 300mm x 200mm 300mm x 200mm 300mm x 200mm 300mm x 200mm 300mm x 200mm 300mm x 200mm

P Series are extremely soft, gel type products,highly conformable thermal interface gap filler designed to meet industry’s rapidly growing need for interface material with high thermal conductivity and conformability for low stress applications.

Ideal for circuit boards where multiple packages of variable heights require a thermal path to heat sink or enclose. Automotive Electronics Control Units (ECU’s), power supplies & semiconductors, memory and power modules and fiber optics telecommunications equipment.

These gel type gap fillers require very low compression force at high compression rates, allowing it to gently conform to most component shapes and uneven surfaces.

This advanced thermal interface material is ideal for applications that have delicate or wide-variation component heights and require material compression between 30% and 80%.

Sheet form (200mm x 300mm) and Custom die-cut parts

Property Test Method P-28 P-61 HTC-11 P-13
Type   Silicone Silicone Silicone Silicone
Color Visual Gray Reddish/Grey Gray Blue
Specific Gravity, @ 25°C ASTM D792 2.6 3.11 3.3 3.3
Hardness
(Shore 00)
ASTM D2240 26 (Gel type) (Gel type) (Gel type)
Flammability UL 94 V-0 Equivalent V-0 Equivalent V-0 Equivalent V-0 Equivalent
Operating Temperature Range.   -40°Cto150°C -40°C to 150°C -40°C to 150°C -40°C to150°C
THERMAL          
Thermal Conductivity
(W/m-K)
ASTM D5470 2.8 6.1 11.0 13.2
Thermal Resistance with compression (°C-in2/w)
(1 mm Thickness)
ASTM D5470 15psi 0.43
40psi 0.30
70psi 0.22
15psi 0.30
40psi 0.20
70psi 0.12
15psi 0.22
40psi 0.12
70psi 0.07
15psi 0.16
40psi 0.07
70psi 0.05
ELECTRICAL          
Breakdown Voltage (KV/mm) ASTM D149 18 12 11 12
Dielectric Constant (1KHz) ASTM D150 6.4 7.2 7.8 7.8
Dissipation Factor (1KHz) ASTM D150 0.030 0.020 0.017 0.040
Volume Resistivity (Ohm-m) ASTM D257 1.0 x 10¹² 1.2 x 10¹² 1.0 x 10¹º 1.2 x 10¹²
Available thickness. mm   1.5 to 5.0 1.5,2.0,2.5 1.0 to 3.0 0.5 to 2.0
Available Sheet size   300mm x 200mm 300mm x 200mm 300mm x 200mm 300mm x 200mm
Thermal-Gap-fillers_AKS_2159

Thermal Gap Fillers

  • Extremely soft and compressible.
  • Use minimum pressure to apply.
  • Thermal conductivity up to 16 W/mK.
  • Available in Silicone & Non-Silicone.
  • Custom die cut to size.

Thermally Conductive Silicone Pads

TIM-PAD Series

TIM-PAD is a family of thermally conductive and electrically insulating silicone pads. They are clean, production-friendly, and efficient alternatives to mica, ceramics, or grease and will provide superb protection against damage due to deformation, shock, or vibration. Available with or without adhesive for easy handling and installation.

 

Interface between a power transistor, CPU, or other heat-generating components. Isolate electrical components and power sources from the heat sink and/or mounting brackets. Interface for discrete semiconductors requiring low-pressure spring clip mounting. Medical devices, military, and industrial controls.

TIM-PAD 1002: Cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. Excellent mechanical and physical characteristics with efficient heat dissipation. Flame retardant with excellent cut-through resistance and resistance to damage from cleaning agents.

TIM-PAD 1041: Offers high thermal conductivity (4.1W/m°k) and high dielectric properties.

TIM-GEL PAD: Very soft, highly conformable pad provides superb protection against damage due to deformation as well as shock or vibration. Gel like modulus provides stress absorbing flexibility.

Sheet form (200mm x 300mm) and Custom die-cut parts

Property Test Method 1001 1002 1003 1041 Gel Pad
Type   Silicone Silicone Silicone Silicone Silicone
Reinforcement   Fiberglass Fiberglass Fiberglass N/A N/A
Adhesive Coating   Available Available Available N/A N/A
Color Visual Gray Brown White White Gray
Specific Gravity, @ 25°C ASTM D792 2.3 2.4 1.7 2.7 2.6
Hardness
(Shore A)
ASTM D2240 87 92 90 80 49 (shore 00)
Elongation % ASTM D412 >2 >2 >3 65 15
Tensile Strength. PSI ASTM D412 10,000 5,690 6091 290 11,000
Flammability
(Equivalent)
UL 94 V-0 V-0 V-0 V-0 V-0
Operating Temperature Range.   -40°C to 150°C -40°C to 150°C -40°C to 150°C -40°C to 150°C -40°C to 150°C
THERMAL            
Thermal Conductivity  (W/m-K) ASTM D5470 1.1 1.6 3.0 4.1 1.6
Thermal Resistance
°C.in²/w
ASTM D5470 0.55 (0.15mm Th) 0.55 (0.20mm Th) 0.31(0.20mm Th) 0.12(0.15mm Th) 0.39(0.25mm Th)
ELECTRICAL            
Breakdown Voltage   (KV/mm) ASTM D149 11 6 11 12 5
Dielectric Constant    (1KHz) ASTM D150 4.5 3.3 3.0 7.5 4.0
Dissipation Factor     (1KHz) ASTM D150 0.003 0.003 0.0005 0.052 0.003
Volume Resistivity   (Ohm-m) ASTM D257 1 x 10¹³ 1 x 10¹³ 1 x 10¹³ 1 x 10¹³ 1 x 10¹³
Available Thickness.mm   0.15, 0.20,0.30 0.15,0.20,0.30 0.20,0.30,0.45,0.85 0.20,0.30,0.45 0.25
Availability   Roll and sheets Roll and sheets Roll and sheets Roll and sheets Sheets
300mm x 200mm
Thermal Gap Fillers & Pads

Thermal Silicone Pad

  • Thermally conductive & electrically insulative.
  • Highly compressible.
  • Good gap filling ability.
  • Excellent thermal conductivity to 4 W/mk.
  • Variable thickness is available.

Thermal Epoxies and Potting

Thermally Conductive Epoxies Adhesives

TIM-800 series

TIM-800 series are thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non-silicone resins. They are designed for the demanding needs of die-attach heat sink bonding and surface mount applications. Rapid heat transfer properties eliminate hot spots and the low epoxy shrinkage factor minimizes the risk of damage to fragile components, resulting in increased operating efficiencies. Available in one part, two parts, heat curable and room temperature cure systems.

 

 

Thermal Epoxy

Thermal Epoxy

  • Available in 1 or 2 part system.
  • Heat or room temperature cure.
  • High thermal conductivity.
  • High bonding strength.
  • Low thermal impedance.

One Part Thermally Conductive Epoxies

Fabricating heat sink, bonding semiconductors, substrate attach, lid seal, SMD attach, stacking components and die attach applications.

  • Superior thermal performance
  • 1 Component Heat Cure
  • Robust and high bonding strength
  • Bonds to most heat conductive substrates like metal, copper, alloy.
  • Good dielectric performance
  • 30cc Syringes
  • 1 Kg Jar
  • 6 oz. Semco & 300cc cartridges
  • 1 gallon & 5-gallon pails

 

Property 813 813LV 813HTC 811HP
Type One Part/Heat Cure One Part/Heat Cure One Part/Heat Cure One Part/Heat Cure
Special Features Thixotropic.
No Sag.
High Bond Strength at high temperature.
Low viscosity.
Thixotropic.
No Sag.
High Bond Strength at high temperature.
High Thermal Conductivity.
Thixotropic.
No Sag.
High Bond Strength at high temperature.
Low Temp Cure.
High temp resistance.
Excellent water, solvent & chemical resistance.
Application LEDs, Thermal die attach, damming. LEDs, Thermal die attach, damming Laser diodes, photovoltaic, high power RF amplifiers Aerospace/high temperature applications
Mix Ratio by volume        
Color Black Black Black Gray
Shelf Life 4 months@ 25°C
6 months@ 5°C
4 months@ 25°C
6 months@ 5°C
4 months@ 25°C
6 months@ 5°C
4 months@ 25°C
6 months@ 5°C
Viscosity @25°Ccp 1,200,000 800,000 900,000 Paste
Gel Time (Pot Life) (100 grams) 30 Min@ 80°C 30 Min@ 80°C 30 Min@ 80°C >180 Min
Cure Schedule 30 min@ 150°C or
60 min@ 125°C
30 min@ 150°C or
60 min@ 125°C
30 min@ 150°C or
60 min@ 125°C
10 min@ 150°C or
45 min@ 125°C
Fixture Time 5-10 min@ 150°C 5-10 min@ 150°C 5-10 min@ 150°C 5-10 min@ 150°C
Hardness (Shore D) 90 90 90 84
Glass Transition Temperature 145°C 145°C 145°C 130°C
Lap Shear Strength. Aluminum 2620psi 2620psi 2620psi 4500psi
Service Temperature Range -55°C  to 200°C -55°C  to 200°C -55°C  to 200°C -55°C  to 230°C
THERMAL        
Thermal Conductivity (W/m-K) 1.8 1.8 2.7 1.5
ELECTRICAL        
Dielectric Strength   (Volts/Mil) 460 460 460 350
Volume Resistivity   (Ohm-cm) 10^15 10^15 10^15 10^15

Two Part Thermally Conductive Epoxies

  • Bonding of heat sink to FR4 or PCB.
  • Bonding of thermistor to electronic substrates.
  • Bonding ferrite to copper plate for heat dissipation.
  • Die attach for thermal management.
  • 2 component epoxy system with long shelf life.
  •  
  • 30cc Syringes
  • 1 Kg Jar
  • 6 oz. Semco & 300cc cartridges
  • 1 gallon & 5-gallon pails
Property 827TC 885 816TC 816HTC 818 802F
Special Features High Strength.
Crack Resistance.
Non-Hazmat Vibration resistance, low temperature flexibility. Very High Thermal Conductivity.
Superior metal to metal bonding.
Flash Cure in 5 minutes.
No mix type
Structure bonding. Vibration & Shock Resistance.
Variety mix ratio offers desire hardness
Type Two Parts Two Parts Two Parts Two Parts Two Parts
/No Mix
Two Parts
Hardener N/A EH-22 N/A N/A 63 EH-14
Mix Ratio by Wt (A/H) 100/46 100/7 100/100 100/100 No Mix type 100/100(see TDS to choose mix ratio
Color Gray Black Black Gray White Clear/Amber
Shelf Life 12 months@ 25°C 12 months@ 25°C 12 months@ 25°C 12 months@ 25°C 12 months@ 25°C 4 months@ 25°C
6 months@ 5°C
Mixed Viscosity @25°Ccp 120,000 Paste >250,000 Paste Paste See TDS
Gel Time (Pot Life) (100 grams) 60 Min @ 25°C 40 Min@ 25°C 45 Min@ 25°C 80 Min@ 25°C N/A 120 Min@ 25°C
Cure Schedule 24 hrs@ 25°C or
30 min@ 90°C
24 hrs@ 25°C or
30 min@ 100°C
24 hrs@ 25°C or
60 min@ 80°C
24 hrs@ 25°C or
30 min@ 90°C
5 minutes @ 25°C.
Flash cure.
24 hrs @ 25°C or
60 min@ 100°C
Cured Properties            
Hardness (Shore D) 86 91 81 86 91 80
Glass Transition Temperature 62°C >70°C 90°C 90°C N/A 85°C
Lap Shear Strength. Alumimum >3500psi >3000psi 3000psi >3500psi 1860psi 3200psi
Service Temperature Range -55°C  to 100°C -55°C  to 150°C -55°C  to 150°C -55°C  to 160°C -55°C  to 150°C -55°C  to 230°C
THERMAL            
Thermal Conductivity (W/m-K) 0.9 1.3 1.6 2.7 0.8 N/A
ELECTRICAL            
Dielectric Strength   (Volts/Mil) 420 430 420 420 570 430
Volume Resistivity   (Ohm-cm) 10^11 10^15 10^14 10^11 10^13 10^15

Thermally Conductive Silicone Potting Compounds

TIM-PC Series

Thermally Conductive, two parts, low viscosity potting compound that cures at room temperature to a soft pliable rubber. Will cure in deep sections. Designed to achieve primerless adhesion to many substrates, including metals, plastics, and ceramics. The excellent electrical properties make it a candidate material for both high and low voltage electrical assemblies.

 

 

Potting and encapsulating of:

  • Equipment modules, Power supplies, relays and amplifiers, Transformers, coils and ferrite cores
  • Fiber optic wave guide coatings
  • Encapsulation of circuit boards
  • Room temperature curable.
  • Flexible after curing.
  • Has good thermal conductivity.
  • Low thermal stress during operation.
  • Good Dieletric Strength.
Property 8550TC 8550AC 8556
Special Features Flame Retardant
Self-Bonding
Flexible, impact and thermal shock resistance.
Low Viscosity
Long pot life
High Dielectric
High Temperature rated up to 240°C
Meets UL94V0
Long pot life
Fast cure
Type Two Parts Two Parts Two Parts
Mix Ratio by Wt (A/H) 1:1 1:1 1:1
Color Gray Gray Black
Shelf Life 12 months@ 25°C 12 months@ 25°C 12 months@ 25°C
Mixed Viscosity @25°C  cp 4000 1300 2000
Gel Time (Pot Life) (100 grams) 1 hr @ 25°C 2 hr @ 25°C 2 hr @ 25°C
Cure Schedule 24-48 hrs@ 25°C or
2 hrs @ 70°C
24-48 hrs@ 25°C or
30 minutes @ 100°C
24 hrs@ 25°C or
15 minutes@ 150°C
Cured Properties      
Hardness (Shore ) A-42 A-62 A-46
Tensile Strength >250psi 450psi >280psi
Service Temperature Range -55°C  to 200°C -55°C  to 200°C -55°C  to 240°C
THERMAL      
Thermal Conductivity  (W/m-K) 1.2 0.65 0.40
ELECTRICAL      
Dielectric Strength   (KV/mm) 17.5 26 17.5
Volume Resistivity   (Ohm-cm) 10^14 10^15 10^15
Thermal Potting 2

Thermal Potting

  • Available in Silicone & Non-Silicone based encapsulation.
  • Excellent thermal conductivity.
  • Provides good electrical insulation.
  • High voltage insulation.
  • Low exothermic.

Thermally Conductive Potting Compounds

TIM-PC Series

TIM-PC series are pourable, filled Silicone Free epoxy resin or silicone resin systems offering excellent heat transfer, high voltage insulation, low exothermic and minimum shrinkage. These compounds transfer heat rapidly, thereby eliminating hot spots and increasing the operating efficiency of most encapsulated devices. The low shrinkage design feature minimizes risk of damage to fragile components.

 

 

These products are designed for protecting components in applications such as densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.

  • Room temperature curable.
  • Flexible after curing.
  • Has good thermal conductivity.
  • Low thermal stress during operation.
  • Good Dieletric Strength.

Silicone-Free Epoxy-Resin based Potting Compounds

Property 8006M-4 8015 8017 8018 8850FT 8850FT-NH
Special Features Flame Retardant
Excellent Adhesion.
Flexible impact resistance.
High Temp Stable up to 230°C.
Long pot life.
High TG
DOT/IATA Non-Hazmat
High Thermal Conductivity.
DOT/IATA Non-Hazmat
High Thermal Conductivity
Available with
selective hardeners
for desire viscosity,
TG, pot life & cure temp.
DOT/IATA Non-Hazmat
Type Two Parts Two Parts Two Parts Two Parts Two Parts Two Parts
Hardener A&B Mix TH-10 TH-40 TH-22 TH-9 TH-22
Mix Ratio by Wt (A/H) 100/12 100/25 100/12 100/8 100/3.5 100/4.5
Color Black Black Black Gray Black Black
Shelf Life 12 months@ 25°C 12 months@ 25°C 12 months@ 25°C 12 months@ 25°C 12 months@ 25°C 12 months@ 25°C
Mixed Viscosity @25°Ccp 4000 3000 20,000 40,000 50,000 50,000
Gel Time (Pot Life) (100 grams) 1 hr @ 25°C >8 hrs @ 25°C 3 hrs @ 25°C 1 hr @ 25°C 1 hr @ 25°C 1 hr @ 25°C
Cure Schedule 24-48 hrs@ 25°C or
2 hrs @ 100°C
2 hrs @ 150°C or
4 hrs @ 100°C
24-48 hrs@ 25°C or
2 hrs @ 65°C
24 hrs@ 25°C or
2 hrs@ 100°C
24-48 hrs@ 25°C or
2 hrs@ 70°C
24-48 hrs@ 25°C or
2 hrs@ 70°C
Cured Properties            
Hardness (Shore ) A-85 D-92 D-93 D-91 D-90 D-90
Glass Transition Temperature 28°C 145°C 75°C >80°C 86°C 86°C
Flexural Strength N/A 12,300psi 13,800psi 12,300psi 14,700psi 14,700psi
Service Temperature Range -55°C  to 120°C -55°C  to 230°C -55°C  to 150°C -55°C  to 150°C -55°C  to 150°C -55°C  to 150°C
THERMAL            
Thermal Conductivity (W/m-K) 0.7 1.4 1.6 2.5 1.6 1.6
ELECTRICAL            
Dielectric Strength   (Volts/Mil) 480 473 460 473 430 430
Volume Resistivity   (Ohm-cm) 10^14 10^16 10^15 10^15 10^15 10^15
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