Semiconductor & Electronics Adhesives

Semiconductor & Electronic Adhesives

Vitrochem Technology is honored to be in partnership with some of the most prominent adhesive specialty companies like AI Technology, Everwide Chemical, Timtronics and Vitrobond to provide and support the Semiconductor & Electronics industries with the extensive range of specialised adhesives systems for the electronics package and assembly purpose. The types of products being offered to this industry range from Die Attach, Dam & Fill, Glop Top Encapsulant (COB), Underfills, Surface Mount Adhesives and many related electronic grade adhesives being used in this specialised field. 

 

 

 

Glop Top Encapsulation
Die Attach Epoxy

Die Attach Adhesives

AIT offers some of the most advanced Die Attach paste adhesives engineered to improve long-term reliability, rapid inline curing, long pot-life, viscosity and thixotropic control for fast automated dispensing and manufacturing. Some of the following representative products have a demonstrated record of more than 20 years of reliability for military and aerospace applications.

 

AIT Part No

Characteristics

Electrical Resistivity (Ohm-cm)

Thermal Conductivity (Watt M-0C)

Die-Shear (PSI)

TG (0C)

Viscosity / Thixotropic Index

EG8020

  • One or two part component

<4x10-4

>5.7

>1,800

50

150,000(cps@ 0.5 rpm)

EG8050-LV

  • Solder replacement-

  • Stress free-Substrate/component

<4x10-4

>7.9

>1,500

-20

129,000(cps@ 0.5 rpm)

EG8050

  • Solder replacement

  • Stress free

<4x10-4

>7.9

>2,000

-20

190,000(cps@ 0.5 rpm)

ME8155

  • Stress free

  • Solvent free

<4x10-4

>7.9

>2,000

-20

354,000(cps@ 0.5 rpm)

ME8452-A

  • Stress free

  • Solvent free

  • Large area die attach

<4x10-4

>7.9

>2,000

-20

255,000(cps@ 0.5 rpm)

ME8456

  • Stress free

  • Large area die attach

<4x10-4

>7.9

>1,000

-20

130,000(cps@ 0.5 rpm)

ME8456-00

  • Ideal for mismatched CTE’s

<4x10-4

>12.5

>1,200

-20

60,000(cps@ 0.5 rpm)

ME8512

  • Solvent free

  • Designed to eliminate bleeding

<4x10-4

>7.9

>1,200

50

15,000(cps@ 0.5 rpm)

ME8550-DA

  • High green strength

  • Moisture resistant

<1x10-3

>7.9

>1,000

-55

40,000(cps@ 5 rpm)

ME8630-DA

  • Solvent free

  • Fine pich

  • Rapid curing

<4x10-4

>8.6

>2,400

80

8,000(cps@ 5 rpm) TI >4.0

ME8630-RC

  • Solvent free

  • Fine pitch

  • Rapid curing for inline process

<5x10-4

>8.6

>2,400

80

15,000(cps@ 5 rpm) TI >4.0

ME8650-DA

  • Solvent free

  • Fine pitch

  • Rapid curing

<4x10-4

>3.6

>1,900

-40

8,000(cps@ 5 rpm) TI >4.0

ME8650-RC

  • Solvent free

  • Fine picth

  • Rapid curing for inline process

<5x10-4

>7.9

>1,500

-20/-50 Minor

18,000(cps@ 5 rpm) TI >4.0

ME8850-DA

  • Stress free

  • High Green Strength

<5x10-4

>7.9

>1,000

-20/-50 minor

10,000(cps@ 5 rpm)

MC8880

  • Solvent free

  • Withstand 350 Deg C

  • Low Moisture Absorption

  • Low Ionics

<5x10-2

>9

>2,500

240

65,000(cps@ 5 rpm)

Vitrobond AG806-2
  • Low stress
  • Rapid curing
  • Good electrical conductivity
0.0005 60 BTU/in 2400 70 30,000 - 40,000

DAF (Die Attach Film) and DDAF (Dicing Die Attach Film) Adhesives

PROVEN RELIABILITY

Die-Attach film (DAF) adhesive has become popular and mandatory when stack chips are used to accomplish larger capacity in 3-D packaging of flash memory devices.  The push now is for an even thinner insulating die-attach adhesive that can properly handle interfacial stresses in stacking chips with bond-lines as thin as 8-10 microns or less to help mobile devices to achieve even lower profiles.

In addition to offering a thinner bond-line for stacked chip devices, film adhesives that are properly engineered for die-attach provide several advantages over traditional paste adhesives for almost all semi-conductor devices:

  • By eliminating the paste dispensing requirement of low viscosity, AIT  produces DAF film adhesives with proper melt-flow and bonding characteristics with engineered molecular structures to manage stress, thermal stability and moisture absorption and sensitivity with unparalleled performance
  • By laminating the DAF film adhesives with controlled thicknesses from 10 microns, AIT DAF adhesives melt-flow at temperatures around 80°C and are thus ambient storable for shipping and handling for one year at ambient temperature before or after dicing
  • AIT is also one of the first to provide proven DAF adhesives that are electrically conductive for power devices in the thickness of 20 microns
  • AIT is also one of the first to provide thermally conductive DAF adhesives that are electrically insulating but thermally conductive with years of proven success manufacturing thicknesses of 20 microns.
  • AIT DAF is also engineered to melt-flow and bond onto substrates at a temperature of 125-175°C with minimal pressure of around 5 psi and continue for full cure at the same temperature without applying pressure.  Unlike paste, the die position will not shift, thus allowing ultra-precise packaging needed in multi-chip modules (MCM) or SiP (System-in-package).

In addition to offering a DAF adhesive with unparalleled performance in managing interfacial stresses even at low bond-line thicknesses, ultra-low moisture-temperature sensitivity, and thermal stability, all with high enough glass transition temperature of 175°C and beyond in enabling high productivity of wire-bonding up to 250°C,   AIT DAF adhesives also feature more common properties used in worldwide production:

  • RoHS and REACH compliant
  • Availability of width for 450mm and beyond for all thicknesses from 10-micron thickness and with option for pre-laminated onto dicing tape (DDAF) with standard, UV, and/or thermal releases
  • Manufactured in a clean room environment with a scalable capacity of more than 10 million square ft per year in the United States.

AIT Part No

Characteristics

Electrical Resistivity (Ohm-cm)

Thermal Conductivity (Watt M-0C)

Die-Shear (PSI)

TG (0C)

Film Thickness

ESP7660-HK-DAF
  • Post-curing without fixture and pressure
  • Meets MIL-STD-883F 5011.4
  • Proven reliability for multilayer stack
>1x1014 >0.8 >4,000 175 10 µ20 µ40 µ
ESP7666-HK-DAF
  • Curing without fixture and pressure
  • Meets MIL-STD-883F 5011.4
  • Low thermal resistance + high moisture resistance
>1x1014 >1.8 >2,000 175 20 µ40 µ
ESP8660-HK-DAF
  • Curing without fixture and pressure
  • Low thermal resistance + high moisture resistance
  • Meets MIL-STD-883F 5011.4
<4x10-4 >8.0 >3,000 175 20 µ40 µ
ESP8450-DAF
  • Optimizing flexibility and strength
  • Proven for extreme large devices
  • Meets MIL-STD-883F 5011.4
  • Low thermal resistance + high moisture resistance
<4x10-4 >8.0 >2,000 90/-50 20 µ40 µ

One Component Heat Cure Epoxy

Vitrochem Technology has been in the forefront of producing an extensive range of  high performance 1 component heat-curable epoxy compound mainly used in the electronic industry for Glob Top (COB), Die Attach, Chips Bonding and Ferrite Bonding applications. These epoxies have been designed to meet the industry standard requirements for its mechanical, electrical, thermal and reliability performances. We can custom build new epoxy formulation and has the ability to turn around the time to market time to meet the growing demands for electronics grade epoxies. 

 

Product No

Characteristics

Application 

Viscosity (cps @ 250C)

Cure Profile

Vitrobond EC 108

  • Thixotropic & high viscosity

  • Low shrinkage

  • High TG

  • Excellent pot life

Glob Top

150’000

130°C @ 1 Hour

Vitrobond EC 1002

  • Low temperature cure

  • Good electrical and thermal properties

  • Good chemical resistance

Glob Top

70’000 – 90’000

900C @ 30 Minutes

Vitrobond EC 5640

  • Low temperature cure

  • Good electrical and thermal properties

  • Good chemical resistance

Glob Top

Potting & Encapsulation

42’000 – 65’000

1000C @ 30 Minutes

800C @ 60 Minutes

Vitrobond VC 108-1

  • Room Temperature Stable for 25 Days

  • High Glass Transition

  • Excellent Thermal & Electrical Properties

Glob Top

72'000 - 95'000

1000C @ 5 Hours

Vitrobond EN 484

  • Black paste

  • Good dielectric properties

  • Bonds well to most metals & plastics

  • High TG

  • Glob Top

  • Bonding of electronic components

  • Sealing of VCM coils

  • Ferrite Bonding

Thixotropic

1000C @ 3 Hours

Vitrobond EN 484

  • Black paste

  • Good dielectric properties

  • Bonds well to most metals & plastics

  • High TG

  • Glob Top

  • Bonding of electronic components

  • Sealing of VCM coils

  • Ferrite Bonding

Thixotropic

1000C @ 3 Hours

Vitrobond EN 640-T5

  • High viscosity

  • Excellent thermal shock resistance

  • Long pot life

Glob Top

72'000

130°C @ 2 Hours

One component heat cure epoxy is a premixed adhesive that has been integrated with the base epoxy resin and hardener into a single system. It takes away the measurement and mixing process that comes along with two components system. The epoxy can be used after it has been thawed from cold storage and the curing profile and time taken varies between the formulation epoxies. These epoxies are designed with different viscosities, glass transition, cure condition and specific functions to serve the applications. 

 

Product No

Characteristics

Application 

Viscosity (cps @ 250C)

Cure Profile

Vitrobond HEM 495
  • High temperature resistance
  • Excellent thermal shock resistance
  • Contains no VOC
  • High TG

Encapsulation

Casting & Potting

40'000 130°C @ 1 Hour
Vitrobond HEM 405
  • High purity
  • Low stress after cure
  • Low viscosity
  • High TG

Potting 

Sealing 

22'000 1000C @ 40 Minutes
Vitrobond JD 322
  • Good bonding strength
  • Fast cure at room temperature
  • Able to pass environmental test

Bonding components

Sealing

128'000 - 195'000

1000C @ 30 Minutes

Or

800C @ 60 Minutes

Vitrobond EC 401
  • Excellent adhesion to ferrite
  • Good heat and chemical resistance
  • Long pot life at ambient

Bonding

Sealing 

48'000 - 50'000 1400C @ 30 Minutes
EW JC 349-4
  • High bonding strength
  • Non volatile
  • High TG of 1300C
  • 7 days pot life at 250C

Bonding

Sealing

71'000 - 82'000 1200C @ 40 Minutes
EW JC 564-34
  • High bonding strength
  • Low shrinkage
  • Good dimensional stability 
  • High TG of 1400C

Bonding

Sealing

Encapsulation 

25'000 - 60'000 1000C @ 60 Minutes
EW JC 564-65
  • High bonding strength
  • Low shrinkage
  • Good dimensional stability 
  • Low-temperature curing

Bonding

Sealing

Encapsulation 

42'000 - 65'000 800C @ 60 Minutes

EW JD 380-8

  • Excellent bonding strength

  • Bonds strong to metals 

  • Crack and fatigue resistance

Bonding

Sealing

241'000 - 363'000

1500C @ 60 Minutes

EW JD 661

  • Tough and strong adhesive

  • Crack and fatigue resistance

  • Vibration resistance

  • Low temperature curing

Bonding

Sealing

15'000 - 23'000

600C @ 60 Minutes

In the fast placement process of Surface Mount Technology, epoxy with high green strength is used to prevent the SMT components from skewing during and after reflow. SMT epoxies are used to bond components on the PCB during wave soldering reflow. The green strength from these epoxies enable it to hold Surface Mount Devices (SMD) from skewing during high speed processing and complete reflow soldering process. The range of SMT epoxies is able to meet the standard specifications required by the PCB assembly industry.

Product No

Characteristics

Application 

Viscosity (cps @ 250C)

Cure Profile

EW JC 711-13
  • Thixotropy
  • Screen printable
  • High green strength & non-slump
  • Withstand solder reflow temperature

Surface Mount Adhesive

80'000 - 150'000
  • 120°C @ 180 Seconds
  • 150°C @ 120 Seconds
  • 180°C @ 90 Seconds
EW JC 711-19
  • Thixotropy
  • Screen printable & dotting
  • High green strength & non-slump
  • Withstand solder reflow temperature

Surface Mount Adhesive

52'800 
  • 120°C @ 180 Seconds
  • 150°C @ 120 Seconds
  • 180°C @ 90 Seconds

In any flip-chip packaging, the Thermal Coefficient of Expansion  (CTE) between the solder ball, silicon die and the bonding substrates vary differently. The CTE mismatch strain will occur greatly if the silicone die is larger in dimension. If such mismatched between the substrates is not addressed, it will cause failure to the flip-chip package. To address it, a liquid underfills encapsulant like epoxy resin with a CTE that is close to solder bumps is filled into the gap or cavity between the silicon die and substrate. With this underfill process, it will enable the stronger adhesion between the silicon die and substrate and at reducing the stress and possible strains on the soldering joints. 

New Generation of Ultra High Tg Underfill

(with Glass Transition of Over 240°C for Ultimate Flip-Chip and Component Stress Management)

Liquid Underfills with Ultra-high Glass Transition (Tg):

  • Balancing these modified cyanate ester underfills that cure to much higher  glass transition temperatures and the stress absorption.
  • Outstanding thermal conductivity and low thermal resistance afford better thermal dissipation from powerful chip to both side of the microelectronic package.
  • Proven in use for the most stringent  military applications

High Melt-Flow Film Underfill for FOW:

  • Outstanding melt-flow and wetting to flow-over-wire for stack-chip applications
  • Ability to cure at lower temperature from 100-150°C for lower interfacial stresses
  • Ideal for large area stack-chip and module
  • Preform with specific thickness accommodates the flip-chip or ball-grid-array  parts with preformed cut-outs for interconnections allowing the film adhesive to flow  and encapsulate for protection

Product No

Characteristics

Application 

Viscosity (cps @ 250C)

Cure Profile

EW JC 823-3
  • Low viscosity
  • Reworkable
  • Fast curing
  • Excellent bonding strength

BGA & CSP Underfill

550 - 850
  • 80°C @ 30 Minutes
  • 100°C @ 15 Minutes
  • 120°C @ 5 Minutes
  • 150°C @ 1 Minutes
EW JC 823-6
  • Medium viscosity
  • Reworkable
  • Fast curing
  • Excellent bonding strength

BGA & CSP Underfill

2'500 - 4'000
  • 80°C @ 30 Minutes
  • 100°C @ 15 Minutes
  • 120°C @ 10 Minutes
  • 150°C @ 5 Minutes
EW JD100-1
  • Medium viscosity
  • Low temperature curing
  • Excellent bonding strength

BGA & Flip Chip

<20'000
  • 60°C @ 20 Minutes
  • 70°C @ 12 Minutes
  • 80°C @ 8 Minutes

Underfill Liquids and Film Adhesives:

FUNCTION AIT PART# THERMAL, ELECTRICAL, & other RELEVANT PROPERTIES
Stress and Thermal Management MC7866-UF
  • Tg ~240°C to ensure minimal stress during lead-free soldering
  • Low curing temperature and low CTE to achieve lower stresses
  • Outstanding thermal conductivity and low interface resistance
Stress and Thermal Management MC7863-UF
  • Tg ~240°C to ensure minimal stress during lead-free soldering
  • Low curing temperature to achieve lower stresses
  • Lowest CTE for internal stress reduction
Stress Management MC7686-UF
  • Tg ~220°C to ensure minimal stress during lead-free soldering
  • Low curing temperature and low CTE to achieve lower stresses
  • Outstanding thermal conductivity and low interface resistance
Flow-Over-Wire Underfill Film Adhesive ESP7660-FOW
  • Tg ~175°C to ensure minimal stress during reflow soldering
  • High flow at low curing temperature of 100-150°C to achieve lower internal stresses
  • High flow at minimal pressure of less than 2 psi for flow-over-wire for stack-chip encapsulation and bonding
Flow-Over-Wire Underfill Film Adhesive CXP7860-FOW
  • Tg ~240°C to ensure minimal stress during reflow soldering
  • High flow at low curing temperature of 100-150°C to achieve lower internal stresses
  • High flow at minimal pressure of less than 2 psi for flow-over-wire for stack-chip encapsulation and bonding
Preform Underfill for Thermal and Stress Management CXP7686-UF
  • Tg ~220°C to ensure minimal stress during reflow soldering
  • High flow at minimal pressure of less than 2 psi for flow-over-wire for stack-chip at low curing temperature of 100-150°C to achieve lower internal stresses
  • Outstanding thermal conductivity and low thermal interface resistance
Preform Underfill for Thermal and Stress Management ESP7666-FOW
  • Tg ~175°C to ensure minimal stress during reflow soldering
  • High flow at minimal pressure of less than 2 psi for flow-over-wire for stack-chip at low curing temperature of 100-150°C to achieve lower internal stresses
  • Outstanding thermal conductivity and low thermal interface resistance

CMOS Chips-min
Microchip Bonding-min

Die Attach Film Adhesives

Underfill & Glob Top Epoxy

Scroll to Top